Environmental Considerations


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ENVIRONMENTAL POLICY & RoHS

Environmental Policy Statement

Volterra Semiconductor is committed to complying with applicable environmental regulations consistent with the needs and requirements of the customers and industries we serve. We recognize that our Environmental Responsibilities include selection of subcontractors having effective Environmental Management Systems, who are reducing or eliminating use of certain hazardous substances in the products and packing materials we provide, and in use in their manufacturing processes.

Internally, we will strive to reduce, reuse, recycle and promote environmental awareness in conducting all our business activities.

Volterra is a fabless semiconductor company. As such, we maintain no manufacturing facilities and subcontract all wafer fabrication, assembly and test operations. Volterra’s Subcontractor Selection & Qualification Procedures SOP QR-0328 clearly conveys our expectations that our subcontractors act responsibly in protecting the environment. These expectations are part of the criteria we use in selecting and qualifying subcontractors and are extracted below:

5.1.1Environmental Responsibilities
5.1.1.1 Volterra’s manufacturing partners are expected to have an established Environmental Management System certified to ISO 14001 or have an active plan to achieve such certification.
5.1.2 Reduction of Hazardous Materials. Volterra’s manufacturing partners are expected to establish a plan for the reduction/elimination of certain hazardous substances consistent with the Kyoto Protocol.

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Reduction of Hazardous Substances (RoHS)

The European Union has adopted Directive 2002/95/EC, Restrictions of Hazardous Substances (“RoHS”), which restricts the use of certain substances in electronic products placed on the market in the European Union after July 1, 2006. Countries outside the European Union are looking to enact similar legislation. The term RoHS means the requirements of the European Union Directive or similar material restriction legislation enacted by any country outside the European Union.

The following substances are prohibited by the RoHS Directive:

  • Lead (Pb)
  • Mercury (Hg)
  • Cadmium (Cd)
  • Hexavalent Chromium (Cr 6+ or CrVI)
  • Polybrominated Biphenyls (PBBs)
  • Polybrominated Diphenyl Ethers (PBDEs)

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Materials Declarations

Declaration of Compliance with RoHS Directive

A materials declaration is a disclosure of the types of substances that a product contains or a disclosure of the hazardous substances that the product does not contain. Suppliers are being asked to declare whether their products are compliant with the EU RoHS Directive. Specifically, suppliers are asked to state whether their products are:

  • COMPLIANT. Compliant without using the exemption for lead in solders for network infrastructure equipment.
  • COMPLIANT WITH EXEMPTION. Compliant only with using the exemption for lead in solders for network infrastructure equipment. I.e., lead (Pb) allowed in solder joints, BGA solder balls and component terminal surface finishes.
  • NOT COMPLIANT.

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Materials Declarations for Volterra's Lead (Pb) Free Products

All Volterra Lead Free Products are RoHS Compliant and do not contain any of the following substances:

  • Cadmium and its compounds
  • Chromium VI compounds
  • Lead and its compounds
  • Mercury and its compounds
  • Polybrominated Biphenyls (PBBs)
  • Polybrominated Diphenyl ethers (PBDEs)
  • Tributyl Tin Oxide (TBTO)
  • Tributyl Tins & Triophenyl Tins
  • Polychlorinated Naphthalenes (with more than 3 chlorine atoms)
  • Short chain chlorinated paraffins
  • Asbestos
  • Azo colorants
  • Ozone depleting substances
  • Radioactive substances

Signed Volterra Materials Declaration [119k, .pdf]

Volterra's lead free products are identified with an "F" in the ordering part number, located just before the package code (i.e., VT1103SFCX), and an "F" as the last digit in the part number as physically marked on the device (i.e., VT1103SF).

Click on the package type below to view the RoHS profile for Volterra's lead free products.

CSP-27 (April 2005) [29k, .pdf]
CSP-30 (April 2005) [29k, .pdf]
CSP-41 (April 2005) [29k, .pdf]
CSP-48 (April 2005) [29k, .pdf]
CSP-50 (April 2005) [29k, .pdf]
CSP-59 (April 2005) [29k, .pdf]
CSP-62 (April 2005) [29k, .pdf]
CSP-75 (April 2005) [29k, .pdf]
LQFP-48 (April 2005) [29k, .pdf]
LQFP-64 (April 2005) [29k, .pdf]
TSSOP-48 (April 2005) [29k, .pdf]

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Materials Declarations for Volterra's Non-Lead Free Products

Volterra’s Generation 1 and 2 products are not offered in Pb-Free versions. These products contain lead in the solder balls and surface finishes. In certain applications, products in BGAs and CSPs may be claimed to be RoHS Compliant with exemption for lead in solders.

Click on the package type below to view the RoHS profile for non-lead free products.

BGA-49 (April 2004) [31k, .pdf]
CSP-27 (April 2004) [30k, .pdf]
CSP-41 (April 2004) [31k, .pdf]
CSP-59 (April 2004) [31k, .pdf]
CSP-75 (April 2004) [31k, .pdf]
LQFP-48 (April 2004) [31k, .pdf]
LQFP-64 (April 2004) [31k, .pdf]
QLP™-16 (April 2004) [31k, .pdf]
QLP™-20 (April 2004) [31k, .pdf]

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Lead Free Products

Volterra’s Generation 1 and 2 products will not be offered as a lead free component.

Products which will not have a Lead Free Option
ProductPackageLead Content
VT102QLP™85Sn/15Pb
VT103QLP™85Sn/15Pb
VT201ABGA63Sn/37Pb
VT202BGA63Sn/37Pb
VT211BGA63Sn/37Pb
VT212BGA63Sn/37Pb
VT1001MLQFP85Sn/15Pb
VT1001SCSP63Sn/37Pb
VT1100MLQFP85Sn/15Pb
VT1100SCSP63Sn/37Pb
VT1101MLQFP85Sn/15Pb
VT1101SCSP63Sn/37Pb
VT1102MLQFP85Sn/15Pb
VT1102SCSP63Sn/37Pb

Volterra’s currently released Generation 3 products will be made available as a lead free option. The leaded versions of these parts will also continue to be available. All future product releases will also have a lead free package option. Products that have both a leaded and lead free option will have differentiated ordering part numbers to designate whether or not they are leaded. The lead free versions will also have a different top mark to easily identify it as a lead free product.

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Material Composition

Package Material Composition
CSPSn/Ag/Cu
(Sn/4Ag/0.5Cu)
LQFP 100% Matte Sn Finish
(Annealed; 1 hour, 150oC)
TSSOP 100% Matte Sn Finish
(Annealed; 1 hour, 150oC)

CSP Lead Free Assembly Recommendations (June 2005) [219k, .pdf]

QLP™ is a registered trademark of ST Assembly Services, Ltd.

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